My idea is along the lines of the old pneumatic spark plug media blaster. Instead, here you media blast or dry ice powder blast the leads on IC's or SMT's. The device is clamped down into a nozzle assembly, and the periphery allows the media to strike the little legs of the device. Thus, the body of the device is spared the scouring action, and only the leads get blasted. You'd have different nozzle assemblies to fit different device outlines (TSSOP, DIP, etc.).
You could also have a array of these nozzles to process devices coming down a conveyor. The motion of the conveyor would be discontinuous to allow row-by-row blasting.
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